5 MP USB 3.0 digital camera captures detailed images of hidden solder joints and PCBs for accurate inspection
90° side-view BGA lens enables analysis of concealed solder connections on BGAs and similar components
Inspectis BGA Basics software provides live image viewing, image capture, distance measurement, and documentation tools
ESD-protected bench-top holder with grounding points ensures safe electronics inspection
Turnkey system includes computer with 27-inch UHD 4K monitor, aluminum carrying case, and all necessary accessories
Summarized by Shop
The Inspectis Microscope Light BGA Inspection System is a reliable hand‑operated optical inspection platform designed for side‑view analysis of BGA, µBGA, CSP, CGA, FipChip, and SMD components on printed circuit boards. Featuring a 5.0 MP USB 3.0 digital camera and versatile optics, this system delivers clear imaging of hidden solder join